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Apple’s next generation iPhone 6 and 5.5-inch “iPhone Air” phablet are reportedly nearing the mass production phase and as a result, we’ve seen component leaks kick into high gear recently. Monday morning we seemingly saw the main printed circuit board (PCB) from the iPhone 6 for the first time, and now a new leak may show the iPhone 6 circuit board next to the same component from the larger 5.5-inch iPhone, again supporting the notion that Apple is planning two new iPhone models this year.